Hollow Glass Microspheres for Adhesives: Lightweight, High-Performance Solutions

Hollow glass microspheres are advanced functional fillers designed to enhance the performance of adhesives across various industries. With their unique lightweight, hollow structure, and exceptional strength-to-density ratio, these microspheres offer a wide range of benefits, making them an ideal choice for modern adhesive formulations.

Density 0.1-1.0 g/cm³
Particle Size 10-200 μm
Compressive Strength 500-30,000 Psi /4-207 Mpa
Thermal Conductivity 0.05-0.15 W/M.K

Product Detail

Key Features of Hollow Glass Microspheres

Lightweight Design: Significantly reduce the density of adhesives, enabling lightweight solutions for industries such as aerospace, automotive, and construction.
Thermal Insulation: Improve thermal management with excellent insulating properties, ideal for applications requiring heat resistance.
Enhanced Flowability: Spherical shape and smooth surface ensure better dispersion and ease of application.
Cost Efficiency: Lower material usage and reduced resin consumption lead to cost savings.
Dimensional Stability: Minimize shrinkage and warping, ensuring consistent performance over time.
Chemical Resistance: Provide superior durability in harsh environments.
Eco-Friendly: Reduce VOC emissions and support sustainable manufacturing practices.

Applications

Hollow glass microspheres are widely used in adhesives for:

Automotive: Lightweight structural adhesives for vehicle assembly and interior bonding.
Aerospace: High-performance adhesives for aircraft components, reducing weight without compromising strength.
Construction: Insulating sealants and adhesives for energy-efficient buildings.
Electronics: Encapsulants and thermal interface materials for electronic devices.
Renewable Energy: Adhesives for solar panels and wind turbine components.

Benefits for Your Business

Improved Product Performance: Enhance the physical, mechanical, and thermal properties of your adhesives.
Cost Savings: Reduce raw material usage and optimize production efficiency.
Sustainability: Meet environmental regulations with low-VOC, eco-friendly formulations.
Versatility: Compatible with a wide range of adhesive systems, including epoxy, polyurethane, and acrylic.

Technical Specifications

Density: 0.1–1.1 g/cm³
Particle Size: 10–200 µm
Compressive Strength: 500–30,000 psi
Thermal Conductivity: 0.05–0.15 W/m·K

Why Choose Our Hollow Glass Microspheres?

High-Quality Materials: Manufactured using premium-grade borosilicate glass for consistent performance.
Custom Solutions: Tailored formulations to meet specific application requirements.
Expert Support: Dedicated technical team to assist with product selection and integration.

Get Started Today

Upgrade your adhesive formulations with hollow glass microspheres and unlock new possibilities for lightweight, high-performance solutions. Contact us to request a sample or learn more about how our products can meet your needs.